|
Technical index
|
Mass Batch
|
Small batch
|
Sample
|
|
Base Material
|
FR4
|
Normal Tg
|
Shengyi S1141、KB6160、Huazhen H140（not suitable for lead free process ）
|
|
Middle Tg
|
For HDI、multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662；
|
|
High Tg
|
For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752；
|
|
Halogen Free
|
Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165
|
|
High CTI
|
CTI≥600 SY S1600、Huazheng H1600HF、H1600A；
|
|
High Frequency
|
Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000
|
|
High Speed
|
SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380
|
|
Flex Material
|
Base
|
Glue-free：Dupont AK XingyangW-type, Panosonic RF-775；
|
|
Coverlay
|
SY SF305C、Xingyang Q-type
|
|
Special PP
|
No flow PP： VT-447LF，Taiguang 370BL Arlon 49N
Ceramic filled adhesive sheet: Rogers4450F
PTFE adhesive sheet： Arlon6700、Taconic FR-27/FR-28
Double-sided coatingPI： xingyang N-1010TF-mb
|
|
Metal Base
|
Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase
|
|
Special
|
High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250）
High thermal conductivity material：92ML
Pure ceramic material：alumina ceramic、Aluminum nitride ceramics
BT material： Taiwan Nanya NGP-200WT
|
|
Layers
|
FR4
|
24
|
36
|
64
|
|
Rigid&Flex /（Flex）
|
16（12）
|
20（12）
|
24（16）
|
|
High Frequency Mixed Lamination
|
12
|
18
|
24
|
|
100% PTFE
|
4
|
12
|
18
|
|
HDI
|
2 steps
|
3 steps
|
4 steps
|
|
Technical Index
|
Mass Batch
|
Small Batch
|
Sample
|
|
Delivery Size
(mm)
|
Max(mm)
|
460*560
|
460*560
|
550*900
|
|
Min(mm)
|
20*20
|
10*10
|
5*10
|
|
Width / Gap
|
Inner（mil）
|
0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6
3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15
6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28
|
|
Outer（mil）
|
1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5
2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13
5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24
12 OZ base copper： 20/28 15 OZ base copper： 24/32
|
|
Line Width Tolerance
|
＞5.0 mil
|
±20%
|
±20%
|
±1.0mil
|
|
≤5.0 mil
|
±1.0mil
|
±1.0mil
|
±1.0mil
|
|
Copper Thickness
|
Inner layer（OZ）
|
4
|
6
|
12
|
|
Out layer（OZ）
|
4
|
6
|
15
|
|
Drilling
|
Min laser （mm）
|
0.1
|
0.1
|
0.1
|
|
Min CNC（mm）
|
0.2
|
0.15
|
0.15
|
|
Max CNC drill bit（mm）
|
6.5
|
6.5
|
6.5
|
|
Min Half Hole(mm)
|
0.5
|
0.4
|
0.4
|
|
PTH Hole (mm)
|
Normal
|
±0.1
|
±0.075
|
±0.075
|
|
Pressing Hole
|
±0.05
|
±0.05
|
±0.05
|
|
Hole Angle (conical)
|
Width of upper diameter≤6.5mm：800、900、1000、1100；Width of upper diameter≥6.5mm：900；
|
|
Precision of Depth-control Drilling（mm）
|
±0.10
|
±0.075
|
±0.05
|
|
Number of blind CNC holes of one side
|
≤2
|
≤3
|
≤4
|
|
Minimum via hole spacing (different network, military, medical, automobile )mm
|
0.50
|
0.45
|
0.40
|
|
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm
|
0.4
|
0.35
|
0.3
|
|
Technical index
|
Mass batch
|
Small batch
|
sample
|
|
Drilling
|
The minimum hole wall spacing of the over hole (the same network mm)
|
0.20
|
0.2
|
0.15
|
|
Minimum hole wall spacing (mm) for device holes
|
0.80
|
0.70
|
0.70
|
|
The minimum distance from via hole to the inner copper or line
|
0.2
|
0.18
|
≤10L: 0.15
>10L: 0.18
|
|
The min distance from Device hole to inner copper or line
|
0.3
|
0.27
|
0.25
|
|
Welding Ring
(mil)
|
Via hole
|
4（HDI 3mil）
|
3.5（HDI 3mil）
|
3
|
|
Component hole
|
8
|
6
|
6
|
|
Solder Dam (mil)
|
（solder mask）
|
5
|
4
|
4
|
|
（hybrid）
|
6
|
5
|
5
|
|
Final Board Thickness
|
＞1.0 mm
|
±10%
|
±8%
|
±8%
|
|
≤1.0 mm
|
±0.1mm
|
±0.1mm
|
±0.1mm
|
|
Board thickness（mm）
|
0.5-5.0
|
0.4-6.5
|
0.3-11.5
|
|
Board thickness/drill bit
|
10:1
|
12:1
|
13:1
|
|
Via hole（drill bit）plug hole（plug solder ）
|
0.25-0.5mm
|
0.20-0.5mm
|
0.15-0.6mm
|
|
Blind buried hole, hole inside pad
|
0.25-0.5mm
|
0.20-0.5mm
|
0.10-0.6mm
|
|
Bow and twist
|
≤0.75%
|
≤0.75%
|
≤0.5%
|
|
Impedance Control
|
≥5.0mil
|
±10%
|
±10%
|
±8%
|
|
<5.0mil
|
±10%
|
±10%
|
±10%
|
|
CNC
|
contour tolerance（mm）
|
±0.15
|
±0.10
|
±0.10
|
|
V-CUT Tolerance of residual thickness(mm)
（mm）
|
±0.15
|
±0.10
|
±0.10
|
|
Routing slot（mm）
|
±0.15
|
±0.10
|
±0.10
|
|
Precision of controlled deep milling（mm）
|
±0.15
|
±0.10
|
±0.10
|
|
Technical index
|
Mass batch
|
Small batch
|
sample
|
|
Contour
|
Bevel edge
|
20～60 degree；±5degree
|
|
Surface Treatments
|
Immersion gold
|
Ni thickness
(micro inch)
|
118-236
|
118-236
|
118-236
|
|
Max gold (uinch)
|
3
|
3
|
6
|
|
Hard gold(Au thick)
|
Gold finger
(uinch)
|
15
|
30
|
60
|
|
NiPdAu
|
NI
(uinch)
|
118-236
|
|
PA
(uinch)
|
2-5
|
|
Au
(uinch)
|
1-5
|
|
Graph electric gold
|
NI
(uinch)
|
120-400
|
|
AU
(uinch)
|
1-3
|
|
Immersion tin
|
Tin
(um)
|
0.8-1.2
|
|
Immersion Ag
|
Ag
(uinch)
|
6-10
|
|
OSP
|
thick
(um)
|
0.2-0.5
|
|
HAL/HAL LF
|
BGApad(mm)
|
≥0.3×0.3
|
|
thickness
（mm）
|
0.6≤H≤3.0
|
|
Board thickness vs hole diameter
|
Press hole≤3:1
|
|
Tin（um）
|
2.0-40.0
|
|
Rigid & Flex
|
Maximum dielectric thickness of flex
|
Glue –free 25um
|
Glue-free 75um
|
Glue-free75um
|
|
Flex part width(mm)
|
≥10
|
≥5
|
≥2
|
|
Max delivery size (mm)
|
200×400
|
200×500
|
400 ×550
|
|
distance of via hole to edge of Rigid&flex(mm)
|
≥1.2
|
≥1.0
|
≥0.8
|
|
(mm)distance of components hole to the edge of R&F
|
≥1.5
|
≥1.2
|
≥1.0
|
|
Technical index
|
Mass batch
|
Small batch
|
sample
|
|
Rigid & Flex
|
Structure
|
The outer layer structure of the flex part, the PI reinforcement structure and the separation structure
|
Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film
|
|
Special Tech
|
Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination
|
Buried magnetic core PCB
|
Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB
|
