Key Features

Multi-layer

1.Up to 64 layers;
2.Back drilling can reduce the loss on signal transmission.

Rigid-Flex

1.Metal-plated holes and PTH Pad on FPC can realize build-buried holes connecting and soldering;
2.Isolated design of multi-layer flexible FPC can fulfill the needs of wide angle or dynamic bending;
3.Exposed FPC and IC stiffener enable the connection of placed components including modules or ICs at any angles;
4.FPC with electromagnetic shielding film fulfills the needs of the electrostatic shielding, magnetic shielding, low frequency alternating magnetic shielding and high frequency electromagnetic shielding;
5.laser blind holes on rigid-flex PCB enable the connection of any layers;
6.Metal-laminated rigid-flex PCB enable better heat radiating.

HDI

1.Multi-step HDI enables the connection between any layers;
2.Cross-layer laser processing can enhance the quality level of multi-step HDI;
3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.

High Frequency / Microwave

1.Multi-layer PTFE laminating enables super high frequency PCB;
2.Laser cutting technology for PTFE laminates can ensure the high accuracy of outlines;
3.Plasma excitation can improve the adhesion of cooper in PTH for those high-frequency laminates and hence improve the reliability of inner-outer layer connection;
4.Special techniques like stepped milling, laser blind-buried holes (HDI) are available for high-frequency PCB;
5.Our lamination technology enables the mixture of high-frequency laminates, high-speed laminates, FR4, PI, metal laminates and other materials.

Metal Core / Metal Base

1.Multi laminating aluminum-based PCBs / Soldering technology to cooper-base PCBs fulfill the needs of better heat radiating on multi-layer PCBs;
2.Buried magnetic core technology for metal-based PCBs with metal laminates in the middle enables heat radiating and also small size integration;
3.The technology of partially buried copper fulfills the needs of cost saving, small size integration and high radiating;
4.The design capability of concentric circles in metal base PCBs enables the isolation between fix holes and PTH holes in those PCBs;
5.The integrated coursing technology in metal base PCBs ensures the high reliability between metal base and epoxy resin or hydrocarbon laminates.  

High Speed Signal Transmission

1.Capable to process the 56Gbps high-speed back panels and 100Gbps high-speed optical modules;
2.1um;Fulfill the needs of ultra-low outline for cooper sheet with 1um roughness;
3.Capable to control ±5% of impedance.

Others

1.Embedding technology fulfills the needs of integrated structure inside PCB to embed magnetic cores, daughter PCBs, metal cores, and components;
2.Special techniques fulfills the needs of controlled milling, vias in pad, half holes, countersink holes, stepped holes / milling, carbon ink, laser profiling and resin plugging.

Characteristics and Advantages

Key Technology

Professional R&D on high density HDI, multi-layer PCB, rigid-flex PCB, embedding technology of small size core, thick GEM, PCB with special requirements from industries like defense / medical / automotive, and others technologies.

Sourcing from Rogers, Shengyi,Wazam, Dupont, Rohmhass, Atotech and other excellent suppliers.

Quality Certificates

ISO standard quality system certificates, high standard environmental-friendly production.

3 agile manufacturing plants and 18 service centers.

Delivery

Prototyping Lead Time (<1㎡)

Mass Production Lead Time

Quality Guarantee

Application

AI, Telecom, Industrial control, Medical, Military, Electricity, Automotive, PCs.

Learn more

Capability

Max 64L, ±1.0mil tolerance control for line, min 0.1mm drill bit.

Learn more

Equipment

Mitsubishi, Burkle, Orbotech, Tek…

Learn more